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Global Smartphone Panel Shipments to Grow 11.4% in 2024, with Chinese Manufacturers’ Market Share Approaching 70%
February 26, 2025 | TrendForceEstimated reading time: 2 minutes
TrendForce’s latest findings reveal that global smartphone panel shipments reached 2.157 billion units in 2024, marking an 11.4% YoY increase—the highest in recent years. This growth is driven by rising sales of new smartphone models, alongside increasing demand for second-hand and refurbished devices.
However, in 2025, as demand for new phones stabilizes and the second-hand market plateaus or slightly declines, global smartphone panel shipments are expected to dip by 3.2%, totaling 2.093 billion units.
BOE retained its leading position among the top five smartphone panel makers with 613 million units shipped in 2024, and shipments are anticipated to grow 2.7% to 630 million units in 2025.
Samsung Display (SDC) ranked second, buoyed by robust demand for AMOLED panels from Apple and its own smartphone lineup, with 378 million units shipped in 2024. However, with Apple expected to diversify its supplier base in 2025, SDC’s shipments could see a slight decline of 3.5%, reaching 365 million units.
HKC cemented its third-place position following rapid growth in a-Si LCD shipments, achieving 228 million units in 2024. Leveraging the cost advantages of its G8.6 production line, HKC anticipates a slight uptick in 2025 shipments to 230 million units (+0.7%), though competition from CSOT may apply pressure.
CSOT saw significant growth, closely collaborating with Xiaomi, which boosted its 2024 shipments to 215 million units, an impressive 83.2% YoY increase. This momentum is expected to continue into 2025, with shipments reaching 223 million units.
Tianma rounds out the top five, shipping 158 million units in 2024. Although declining demand for LTPS LCD panels poses a challenge, increasing market interest in AMOLED is expected to drive a 10% increase in Tianma’s 2025 shipments.
TrendForce highlights that demand for AMOLED panels remains strong in 2024, propelling shipment growth across major panel makers—a trend likely to continue into 2025. Conversely, demand for LTPS LCD panels, commonly used in mid-to-low-end smartphones, is gradually weakening, posing significant challenges for suppliers specializing in this technology.
The rapid expansion of HKC and CSOT has led to a shrinking market share for Taiwanese a-Si LCD suppliers. Japanese panel makers have steadily withdrawn from the smartphone market, further reducing their share. Meanwhile, South Korean manufacturers continue to leverage their advanced flexible AMOLED technology to maintain dominance in the high-end segment, with a 20-21% market share in 2024.
Chinese manufacturers, driven by growing demand for both mid-to-high-end AMOLED and entry-level a-Si LCD panels, have aggressively expanded their market presence. In 2024, their combined market share is projected to reach 69.8% and may exceed 70% in 2025, solidifying their crucial role in the global smartphone supply chain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.