-
-
News
News Highlights
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
March 3, 2025 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.
Electrical performance optimized for 76-81 GHz automotive radar applications
RO4830 Plus woven glass free, thermoset laminates possess the stable dielectric constant and low insertion loss required by RF designers for millimeter wave automotive radar sensors. The design dielectric constant of RO4830 Plus laminates is approximately 3.03 at 77GHz (microstrip differential phase length method). The combination of Rogers’ new low-loss thermoset resin and very low profile electrodeposited copper foil translates to a very low insertion loss of 1.5 dB/inch for 5mil laminates, as measured by the microstrip differential phase length method.
PCB fabrication characteristics reduce overall PCB manufacturing costs
RO4830 Plus laminates are engineered for the cap layer on FR-4 multi-layer board designs, which are commonly used for 76- 81 GHz automotive radar sensor PCB applications. These thermoset laminates are free of woven glass, contributing to good laser drilling performance, and CAF resistance. RO4830 Plus laminates can be fabricated using standard epoxy/glass (FR-4) processes and are compatible with RO4400™ bond ply. These PFAS-free laminates have the UL-V0 flame retardant rating and are lead free solder process compatible.
RO4830 Plus laminates provide:
- Stable dielectric constant and low insertion loss at 77GHz via Rogers’ new thermoset resin system combined with a very low profile electrodeposited copper (VLP ED).
- New woven-glass-free thermoset material maximizes fabrication yield and efficiency, further reducing the overall cost of PCBs.
Available in dielectric thicknesses of 0.005, Rogers RO4830 Plus laminates are available in standard panel sizes of 24×18 in. (610×457 mm), 24×20 in. (610×508 mm), 24×21in. (610×533 mm) with 0.5 oz. (18 µm) VLP ED.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
04/09/2026 | I-Connect007I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
Flex Circuit Connectors Standard and Custom Parts Offered
02/04/2026 | PRNewswireETCO Incorporated has introduced a line of connectors for attaching wires to laminates and other flexible circuits that must bend, fold, or fit into tight, moving, or weight-sensitive spaces in consumer, medical, aerospace, and military applications.
DuPont to Outline Value Creation Strategy and Financial Framework
09/18/2025 | PRNewswireDuPont is hosting its 2025 Investor Day with members of its senior leadership team to introduce the new DuPont portfolio following the intended spin-off of its electronics business, Qnity Electronics, Inc. on November 1, 2025..