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iMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’

03/05/2025 | Marcy LaRont, I-Connect007
It was a cool and sunny morning as I headed out to the iMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. iMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.

Alpha and Omega Semiconductor to Feature Groundbreaking Controllers for AI and Robust Packaging Advancements at APEC 2025

03/05/2025 | Alpha and Omega Semiconductor
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).

U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B

03/05/2025 | TrendForce
TrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.

ITW EAE Electrovert Unveils Aquastorm 160 a Compact Design that Meets Unmatched Cleaning Performance

03/04/2025 | ITW EAE
Electrovert, a leader in innovative cleaning solutions, proudly announces the launch of the Aquastorm 160 (AS160), an advanced cleaning system designed to deliver superior performance with a compact footprint. 

Yamaha Robotics Advanced Safety Package Eases Factory-safety Enhancement

03/04/2025 | Yamaha Robotics SMT Section
Yamaha Robotics SMT Section has extended availability of the Advanced Safety Package, which contains optional features to elevate printer and mounter safety above and beyond mandatory levels.
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