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Smarter Machines Use AOI to Transform PCB Inspections

06/30/2025 | Marcy LaRont, PCB007 Magazine
As automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.

Technica USA Hosts Marek Mosakowski, Product Manager for REECO

06/25/2025 | Technica USA
This week, Technica USA had the pleasure of hosting Marek Mosakowski, Product Manager for REECO, at our San Jose offices. During his visit, Marek met with customers across the Bay Area to introduce REECO’s extensive line of ESD (Electrostatic Discharge) clothing and showcase the brand’s latest innovations.

Technica USA Announces New Strategic Partnership with I.T.C. Intercircuit Production GmbH

06/24/2025 | Technica USA
Technica USA is pleased to announce a new distribution and representative agreement with I.T.C. Intercircuit Production GmbH, a globally recognized manufacturer of advanced equipment for the PCB manufacturing industry.

Smart Automation: The Power of Data Integration in Electronics Manufacturing

06/24/2025 | Josh Casper -- Column: Smart Automation
As EMS companies adopt automation, machine data collection and integration are among the biggest challenges. It’s now commonplace for equipment to collect and output vast amounts of data, sometimes more than a manufacturer knows what to do with. While many OEM equipment vendors offer full-line solutions, most EMS companies still take a vendor-agnostic approach, selecting the equipment companies that best serve their needs rather than a single-vendor solution.

The Chemical Connection: Through-glass Vias in Glass Substrates

06/24/2025 | Don Ball -- Column: The Chemical Connection
This month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
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