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Suggested Items

November SMT007 Magazine Explores the New Age of Sourcing

11/03/2026 | I-Connect007 Editorial Team
The November 2026 issue of SMT007 Magazine, “The New Age of Sourcing,” examines how EMS companies are gaining better visibility and control over purchasing, inventory, and supply chain costs. After years of disruption, sourcing teams are finding new ways to move beyond spreadsheets and put more complete, consistent information to work.

Nolan's Notes: When Sourcing Gets Smarter

11/04/2026 | Nolan Johnson -- Column: Nolan's Notes
“It’s a New Age” is such a cliché. I roll my eyes whenever I hear it. In the 1969 musical “Hair,” they sang about the “Age of Aquarius,” a time that would bring peace, love, harmony, and understanding. While an “age” is an indefinite unit of measurement, these free-spirited hippies were referring to an astrological age, which lasts about 2,160 years (although its exact start is open to interpretation). Geologically speaking, an age spans 2 to 10 million years. That is, in fact, a very long time. This all just illustrates why, when that phrase gets dropped into a conversation, my proverbial cynical eyebrow gets raised.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/16/2026 | Michelle Te, I-Connect007
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit. But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.

October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.
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