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New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?

05/09/2025 | I-Connect007 Editorial Team
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.

Nolan's Notes: The Next Killer App in Component Manufacturing

05/02/2025 | Nolan Johnson -- Column: Nolan's Notes
For quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.

Discover the Future of AI in Test and Inspection in the May 2025 Issue of SMT007 Magazine

05/01/2025 | I-Connect007 Editorial Team
Are you ready to explore the cutting-edge advancements in AI shaping the electronics manufacturing industry through test and inspection? The May 2025 issue of SMT007 Magazine provides insights, innovations, and perspectives from today's top experts you won't find anywhere else.

Marcy’s Musings: Can You Hear the Voices?

04/16/2025 | Marcy LaRont -- Column: Marcy's Musings
Tariffs, CapEx spending, the war in Ukraine, and domestic and global economies: I wanted to know what’s on your minds as we launch headlong into Q2 2025. So, this month, I’m highlighting industry voices and how they feel about their businesses, the effects of a new U.S. administration, and where technology is heading.

The Key to First-pass Success in PCB Design

04/10/2025 | Gerry Partida, Summit Interconnect
In the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
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