-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
March 10, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Live@APEX is a unique collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.
“At Indium Corporation, our motto ‘From One Engineer to Another®’ is foundational to the way we work,” said Product Development Specialist Miloš Lazić. “Live demonstrations of these products give attendees a clear and honest look at their real-world performance. We take great pride in our products and we look forward to showcasing them at IPC APEX.”
This year’s program will highlight Indium Corporation materials, including:
- CW-818 – no-clean, high-reliability flux-cored wire
- FP-500 – no-clean flux pen
- Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
- Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
- Indium12.8HF – jetting and microdispensing solder paste
- NC-506 – a low-viscosity thixotropic no-clean flux designed for use in ball-attachment to substrates
- Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
- TACFlux® 089HF – no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder)
Attendees can see these products at the following partner booths:
- AIR-VAC Engineering (booth #1413)
- American Hakko Products, Inc. (booth #2837)
- Apollo Seiko (booth #2713)
- Essemtec (booth #2148)
- Finetech USA (booth #2201)
- GPD Global, Inc (booth #920)
- ITW EAE (booth #2400)
- Juki Americas (booth #2124)
- Koh Young America, Inc. (booth #2130)
- KYZEN (booth #642)
- MicroCare, LLC (booth #2629)
- Mycronic (booth #1842)
- NSW Automation Sdn. Bhd. (booth #531)
- Panasonic Connect (booth #830)
- Parmi USA, Inc. (booth #910)
- Pillarhouse USA, Inc. (booth #1004)
- PVA (booth #626)
- Smart Sonic (booth #2703)
- SuperDry Totech (booth #3502)
- Trans-Tec America (booth #1448)
- Universal Instruments Corp. (booth #1305)
- VERMES Microdispensing (booth #1329)
- Yamaha Motor Corporation (booth #1828)
- ZESTRON Americas (booth #3505)
If you see an Indium Corporation product running in a booth, be sure to use the hashtag #LiveatAPEX.
Suggested Items
Axxon-Mycronic Showcases Precision Protection Technologies for Extreme Environments at Space Tech Expo
06/02/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is pleased to announce its participation at the Space Tech Expo USA 2025, taking place June 3-4, 2025 at the Long Beach Convention Center in Long Beach, California. Axxon-Mycronic will be exhibiting in Booth #552.
CIMS to Exhibit at JPCA Show 2025
05/28/2025 | CIMSCIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
05/07/2025 | StratEdgeStratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.
YINCAE to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025
04/16/2025 | YINCAEYINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, is proud to announce its participation in SEMICON Southeast Asia 2025.
Technica USA and CBT Introducing TiTAN Hybrid at IPC APEX EXPO 2025
03/18/2025 | Technica USAThe wait is over! Technica and CBT are proud to unveil TiTAN Hybrid, a groundbreaking innovation set to redefine the PCB industry. Designed for unmatched performance, efficiency, and adaptability, this cutting-edge laser imaging technology brings the future to you—today.