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CIMS to Exhibit at JPCA Show 2025
May 28, 2025 | CIMSEstimated reading time: Less than a minute
CIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
We are excited to announce that CIMS will be exhibiting at the Japan Printed Circuit Association (JPCA) Show 2025, the premier event for the PCB industry in Japan. The show will take place in Tokyo from June 4th to 6th, and we invite you to visit us at Booth #5E-01, where we will be co-exhibiting with our partner, Hakuto.
At our booth, we will showcase our cutting-edge Galaxy 5Cx AOI system—a high-precision inspection solution capable of detecting defects down to 5-micron line/space in complex IC substrates, equipped with TrueColor™ image acquisition technology and other latest enhancements. Discover how CIMS’ advanced inspection technologies and smart factory solutions can enhance quality and efficiency for IC substrate manufacturers.
Don’t miss this opportunity to explore the latest innovations—visit us at JPCA 2025!
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Rachael Temple - AlltematedSuggested Items
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
10/21/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has received an order from U.S. Customs and Border Protection (CBP) for 15 of its Griffin™ G510x portable chemical detectors, specifically designed to analyze and identify explosives and narcotics, such as fentanyl and nitazenes, within five minutes.
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.