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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
March 10, 2025 | MulticircuitsEstimated reading time: 1 minute
Mike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
Copper via fill technology plays a crucial role in improving signal integrity, increasing thermal conductivity, and enhancing circuit density. This advanced process ensures superior performance for high-density interconnect (HDI) and multilayer PCBs, reinforcing Multicircuits' reputation as an industry leader in precision manufacturing.
“We continuously invest in cutting-edge technologies to provide our customers with the most advanced PCB solutions,” said Mr. Thiel when making the announcement. “The addition of copper via fill strengthens our commitment to innovation and positions us as a premier partner for high-performance electronics manufacturing.”
Dave Kemper, Process Engineering Manager at Multicircuits, highlighted the technical advantages of this new capability, “This new process allows us to manufacture more robust PCBs with improved electrical and thermal properties. Our team has worked diligently to ensure a seamless integration of this process, and we are excited to offer this enhanced service to our customers.”
With the introduction of automated copper via fill, Multicircuits continues to push the boundaries of PCB technology, delivering superior reliability and performance to customers across a wide range of industries.
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