The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
It’s Only Common Sense: Why Failure Is an Opportunity for Growth
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
March 13, 2025 | TSMCEstimated reading time: 1 minute
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process. This achievement makes it possible to integrate these two essential components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products, enabling a significantly smaller form factor while enjoying performance competitive with stand-alone modules.
The smaller area enabled by TSMC’s advanced N6RF+ technology can reduce the size of the wireless connectivity product module by a double-digit percentage. In addition, TSMC and MediaTek’s results showed significant improvement in power efficiency for the PMU compared with existing solutions, while iPA performance was competitive with benchmark products. As the world’s leading supplier of wireless connectivity solutions, MediaTek is well positioned to leverage these advancements to ensure top product performance as it shifts towards the next generation.
A direct result of MediaTek and TSMC’s close collaboration on Design-Technology Co-Optimization (DTCO), MediaTek drew on its product and design expertise to drive system specifications and technology requirements for this project, and TSMC enhanced its technology to enable differentiation in the products.
“After a year of working together on N6RF+, the test chip has exhibited excellent power efficiency gains," said Ching San Wu, Corporate Vice President at MediaTek. "By combining MediaTek's leadership in wireless technology and TSMC's expertise on DTCO, N6RF+ will become a competitive technology for RFSoC projects, creating a significant advantage in the industry."
“Successful DTCO between foundry and customer requires strong mutual trust and teamwork, and we are delighted in this joint accomplishment with a wireless connectivity leader like MediaTek,” said Lipen Yuan, senior director of Advanced Technology Business Development at TSMC. “This achievement on TSMC’s N6RF+ process shows how TSMC combines its leadership in advanced logic and broad portfolio of specialty technologies to provide differentiated solutions for customers’ products.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
A.R.T. Ltd. Nominated in Four Categories at 2025 Instrumentation and Electronics Industry Awards
08/11/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of electronics training and consultancy, has been shortlisted in four categories at the 2025 Instrumentation and Electronics Industry Awards, including Industry Personality, Academic Support, Rising Star, and Best Customer Service.