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Advanced Electronics Packaging Digest

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Tata Electronics, ASML Announce Strategic Partnership to Advance the Semiconductor Manufacturing Ecosystem in India

05/21/2026 | Tata Electronics
Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and ASML, one of the world’s leading semiconductor equipment manufacturing companies, announced the signing of a Memorandum of Understanding (MoU) to advance the semiconductor manufacturing ecosystem in India.

Imec Expands Global Footprint of imec.ventures with a dedicated US presence

05/21/2026 | Imec
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, unveiled a dedicated imec.ventures presence in the United States, with teams in Silicon Valley and on the East Coast.

Semi-Kinetics Brings on Colin Forgy to Lead Manufacturing at Idaho Facility

05/21/2026 | Semi-Kinetics
Semi-Kinetics, a leading provider of electronic manufacturing services, has named Colin Forgy as Manufacturing Manager at its Nampa, Idaho operation, adding a hands-on leader with a track record of improving performance on the production floor.

Asahi Kasei Develops Photosensitive Polyimide Film for Panel-Level Semiconductor Packaging

05/21/2026 | BUSINESS WIRE
Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response to these market changes, Asahi Kasei, a diversified global company, has combined the features of its photosensitive polyimide (PSPI) and dry film photoresist (DFR) into a new photosensitive film.

TSMC to Sell 8.1% of Vanguard International Semiconductor

05/18/2026 | TSMC
TSMC plans to execute the sale of up to 152.0 million common shares of Vanguard International Semiconductor Corporation (VIS), or approximately 8.1% of VIS’ fully-diluted paid-in-capital through a block trade to financial institutional investors.
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