-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
March 24, 2025 | ZukenEstimated reading time: 1 minute
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.
Zuken has also signed an agreement with IBM for the joint research and development of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3-D integrated circuit (3DIC) packaging design for advanced semiconductors and optimizing Electronic Design Automation (EDA) workflows. Zuken will support the evaluation of a prototype deep learning accelerator core from IBM’s digital and analog projects. Additionally, Zuken will contribute to material development and processes modeling, and integration assembly methods for interconnecting multiple IC dies within a semiconductor packaging module. The agreement will further focus on reliability testing, performance simulation, and hardware validation.
"Zuken is pleased to collaborate with IBM Research as a member of the AI Hardware Center and joint development partner," said Kazuhiro Kariya, Zuken's Senior Managing Executive Officer and CTO. "Our unique system-level design platform supports innovation in 3DIC heterogeneous integration design process by enabling a practical SOC/package/PCB co-design environment. Zuken aims to play an important role in the next-generation high-end device development ecosystem."
“We are thrilled to be working with Zuken to accelerate chip packaging and AI hardware innovation,” said Jeff Burns, Director of the IBM Research AI Hardware Center. “These advances will play a critical role in unlocking the performance and efficiency needed for the future of AI.”
Zuken views 3DIC packaging design as a key enabler for future technological innovation and continues to invest in R&D. Open collaboration with industry consortiums is critical, and our collaboration with IBM Research reflects our commitment to expanding technological capabilities and providing innovative solutions to our customers.
Suggested Items
Hon Hai Research Institute Achieves Breakthrough in Quantum Cryptography Recognized by Leading Global Conference
06/17/2025 | FoxconnHon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing.
VIAVI, Hanyang University Sign Memorandum of Understanding to Advance 6G Research
06/10/2025 | PRNewswireVIAVI Solutions Inc. and Hanyang University, one of South Korea's leading academic institutions, today announced a Memorandum of Understanding to collaborate on AI-RAN, 5G and 6G research at the university's Beyond-G Global Innovation Center.
IDC Increases its PC and Tablet Forecasts Despite Tariff Uncertainty
06/02/2025 | IDCAfter recording strong results in the first quarter of 2025, IDC is increasing its traditional PC forecast for 2025 — this comes despite the significant impact that US tariffs have had on its trading partners’ market sentiment.
IonQ Signs MoU with KISTI to Accelerate South Korea’s Role in the Global Quantum Race
06/02/2025 | IonQIonQ, a leading commercial quantum computing and networking company, today announced the signing of a memorandum of understanding (MoU) with the Korea Institute of Science and Technology Information (KISTI), a leading national science and technology research institute and supercomputing center.
Stephen Winchell Appointed DARPA Director
06/02/2025 | DARPAStephen Winchell was sworn in today as the 24th director of the Defense Advanced Research Projects Agency.