Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Real Time with... IPC APEX EXPO 2025: Kyzen—Enhancing PCB Cleaning Processes
March 26, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Jayson Moy of Kyzen discusses recent changes the company has made that are aimed at adding value to the industry. He highlights the significance of a reliable cleaning process for PCBs, which can prevent issues and boost efficiency. The conversation covers metrics for monitoring defects with SPI machines, measuring ROI through yield improvements, and cost savings. KYZEN has announced a new electronic product focused on flux compatibility that's expected to launch later this year.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Real Time with... IPC APEX EXPO 2025: Winner of the IPC Best Student Poster Award
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Rising Star Award: Paavo Niskala, TactoTek
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Real Time with... IPC APEX EXPO 2025: TRI Innovation—Transforming Semiconductor Inspection with AI Technology
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Driving Sustainability in PCB Design
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