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Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Real Time with... IPC APEX EXPO 2025: Emphasizing Sustainability in PCB Design with Summit Interconnect
March 27, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
I-Connect007's Andy Shaughnessy and Gerry Partida of Summit Interconnect discuss the rising customer interest in sustainability within PCB design. Gerry points out that many designs neglect sustainability, resulting in low yields and higher costs. The conversation stresses the importance of adhering to PCB standards and collaborating with fabricators to tackle design challenges and enhance sustainability.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/07/2025 | Marcy LaRont, I-Connect007In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly.
CSP CapEx Expected to Exceed US$600 Billion in 2026, Ushering in a New Growth Cycle for the AI Hardware Ecosystem
11/06/2025 | TrendForceAs major North American CSPs release their latest earnings and investment outlooks, TrendForce has increased its 2025 CapEx forecast for the top eight CSPs worldwide from 61% YoY growth to 65%.
A Catalyst for Success: Meet Emerging Engineers Using the Global Electronics Association to Advance Their Careers
10/06/2025 | Charlene Gunter du Plessis, The Electronics FoundationThe Emerging Engineer program for the Global Electronics Association is a catalyst for student success, offering tools, resources, and experiences that help shape informed, capable, and confident future engineers. The Electronics Foundation (formerly known as the IPC Education Foundation) invited the following students to attend IPC APEX EXPO 2025 and participate in this program.
The Global Electronics Association Launches Design Village at APEX EXPO 2026
09/02/2025 | Global Electronics AssociationAPEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced the launch of the Design Village, a new feature in the exhibit hall that will unite the world’s leading innovators and showcase next-generation solutions for the electronics industry.
IPC Issues Call for Participation for IPC APEX EXPO 2026
06/02/2025 | IPCIPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.