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AI Boom Drives Surge in Data Center Interconnect Demand; Global Market Value to Grow 14.3% in 2025

05/19/2025 | TrendForce
TrendForce reports that leading global telecom providers such as SK Telecom and Deutsche Telekom are rolling out Agentic AI services for general users as generative AI becomes increasingly integrated into daily life in 2025.

Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025

04/29/2025 | congatec
congatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.

Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections

04/11/2025 | Saki Corporation
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.

Würth Elektronik Presents its Setebos-I FeatherWing

04/02/2025 | Wurth Elektronik
Würth Elektronik expands its range of FeatherWings with the Setebos-I radio module. Developers using the practical plug-in boards for fast prototyping benefit from the combined functionality of the manufacturer’s two tried and tested radio modules.

Meyer Burger, OGT Solar Sign Module Supply Agreement for Italy

04/02/2025 | Meyer Burger
Meyer Burger Technology AG and OGT Solar have signed a supply agreement. The high-performance modules “Made in Germany” were manufactured at the Freiberg plant in Germany and are intended for the Italian market.
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