-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
April 2, 2025 | TeradyneEstimated reading time: 1 minute
Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics. This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
The new test cell integrates Teradyne's UltraFLEXplus automated test equipment (ATE) and programming environment, IG-XL, with ficonTEC's advanced optical alignment, probing, and wafer handling technologies. This collaboration enables the testing of hybrid bonded PIC/EIC wafers in a production environment.
While the partnership with ficonTEC enables Teradyne to bring a production-ready system to market today, Teradyne is committed to fostering an open ecosystem for silicon photonics and CPO testing. By ensuring that the UltraFLEXplus is compatible with industry-leading optical instrumentation, probers, alignment systems, and probe cards, Teradyne is delivering a seamless and flexible testing environment for its customers.
"At Teradyne, we believe in the power of collaboration and innovation. Our partnership with ficonTEC enables us to deliver the first high-volume double-sided test cell for silicon photonics wafer test to meet the quickly evolving needs of the industry. Our commitment to an open ecosystem ensures our customers can choose the solution that is right for them," said Regan Mills, President, Product Test at Teradyne.
The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market. By enabling high-throughput electro-optical testing of silicon photonic wafers, this solution addresses the critical need for known good die testing before wafers are diced and packaged into CPO devices or pluggable transceivers. The integration of Teradyne's UltraFLEXplus and ficonTEC's optical alignment and probing technologies ensures that the test cell operates efficiently within the existing fab and OSAT test floor infrastructure, providing a comprehensive and cost-effective solution.
"ficonTEC is proud to partner with Teradyne to pioneer this innovative solution for the rapidly developing market. Our joint effort uniquely combines the class-leading capability of both companies, delivering a high-throughput, cost-effective test solution for silicon photonics and CPO manufacturing workflows," said Stefano Concezzi, Corporate Vice President at ficonTEC.
Suggested Items
Koh Young Installs 24,000th Inspection System at Fabrinet Chonburi
04/23/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at Fabrinet Chonburi in Thailand. This advanced facility is operated by Fabrinet Co., Ltd., a global provider of advanced manufacturing services, specializing in complex optical, electro-optical, and electronic products
PTCRB Certification Adds New IoT Chipset Certification Category, Certifies Sony's Altair ALT1350 CTIA Certification
04/23/2025 | PRNewswireCTIA Certification announced the first PTCRB certified IoT chipset, Sony's Altair ALT1350.
Yamaha Boosts YRi-V AOI Productivity with 3D Component Update
04/22/2025 | Yamaha RoboticsYamaha Robotics Europe SMT Section has introduced instantaneous 3D component update, included with the latest software release for YRi-V automatic optical inspection (AOI) systems, letting users optimise inspection programs without stopping production.
NASA Aims to Fly First Quantum Sensor for Gravity Measurements
04/18/2025 | NASAA lumpy, colorful 3D model of the Earth against a black background, illustrating variations in gravity. North and South America are visible. Red areas show higher gravity, blue areas show lower gravity.
Real Time with... IPC APEX EXPO 2025: Aster—Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.