The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 
Global Sourcing Spotlight: Evaluating a Supplier’s Capabilities
Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
April 2, 2025 | TeradyneEstimated reading time: 1 minute
Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics. This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
The new test cell integrates Teradyne's UltraFLEXplus automated test equipment (ATE) and programming environment, IG-XL, with ficonTEC's advanced optical alignment, probing, and wafer handling technologies. This collaboration enables the testing of hybrid bonded PIC/EIC wafers in a production environment.
While the partnership with ficonTEC enables Teradyne to bring a production-ready system to market today, Teradyne is committed to fostering an open ecosystem for silicon photonics and CPO testing. By ensuring that the UltraFLEXplus is compatible with industry-leading optical instrumentation, probers, alignment systems, and probe cards, Teradyne is delivering a seamless and flexible testing environment for its customers.
"At Teradyne, we believe in the power of collaboration and innovation. Our partnership with ficonTEC enables us to deliver the first high-volume double-sided test cell for silicon photonics wafer test to meet the quickly evolving needs of the industry. Our commitment to an open ecosystem ensures our customers can choose the solution that is right for them," said Regan Mills, President, Product Test at Teradyne.
The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market. By enabling high-throughput electro-optical testing of silicon photonic wafers, this solution addresses the critical need for known good die testing before wafers are diced and packaged into CPO devices or pluggable transceivers. The integration of Teradyne's UltraFLEXplus and ficonTEC's optical alignment and probing technologies ensures that the test cell operates efficiently within the existing fab and OSAT test floor infrastructure, providing a comprehensive and cost-effective solution.
"ficonTEC is proud to partner with Teradyne to pioneer this innovative solution for the rapidly developing market. Our joint effort uniquely combines the class-leading capability of both companies, delivering a high-throughput, cost-effective test solution for silicon photonics and CPO manufacturing workflows," said Stefano Concezzi, Corporate Vice President at ficonTEC.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
TTCI Celebrates Melanie Rutkauskas’ 10-Year Anniversary and Her Leadership of New Training Division
06/12/2025 | TTCIThe Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to celebrate Melanie Rutkauskas on her 10-year anniversary with the company.
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.
IPC Hall of Fame Spotlight Series: Highlighting Bob Neves
06/11/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.