Designers Notebook: Power and Ground Distribution Basics
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
April 3, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Erik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, The Designer's Guide to... More Secrets of High-Speed PCBs, features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
10/30/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
The Shaughnessy Report: Watt About Power Integrity?
10/08/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportYes, that headline is the equivalent of a dad joke, but editors can’t pass up a chance to inject a little humor into a headline, and I had to take my shot. Power integrity (PI) problems are no joke. Current power demands are increasing, especially with AI, 5G, and EV chips, which can lead to voltage drops that kill your performance.
New Fil Arzola Class: Designing for the Future, and for Sustainability
10/07/2025 | Andy Shaughnessy, I-Connect007If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.