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Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future

04/24/2025 |
Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.

Saki America, Appoints Mario Ramírez Galindo as Project Engineer in Mexico

04/17/2025 | Saki America,
Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the appointment of Mario Ramírez Galindo as Project Engineer in Mexico. In this role, Mario will support Saki’s customers by providing technical expertise, process optimization, and project management to enhance manufacturing efficiency and inspection accuracy.

Real Time with... IPC APEX EXPO 2025: IPC Mexico Building Community and Partnerships

04/17/2025 | Real Time with...IPC APEX EXPO
Lorena Villanueva highlights IPC Mexico's three-year journey focused on community building and partnerships with governments and educational institutions. Key milestones include collaboration agreements with state governments and universities to enhance the electronics industry. IPC Days promotes networking and education, while a partnership with UNAM aims to integrate IPC training into engineering programs. The discussion wraps up with congratulations on IPC Mexico's achievements and the launch of the Mexico pavilion at this year's show.

INEMI Announces Board of Directors Election Results

04/16/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.

Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead

04/17/2025 | Jerome Larez -- Column: Global PCB Connections
High density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.
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