Fresh PCB Concepts: The Importance of Bare Board Testing for Reliability
Elementary, Mr. Watson: Design Intent Over Design Speed
Beyond Design: Managing Linear Workflow Bottlenecks
Designing Through the Noise: April 2025 Design007 Magazine
April 8, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Designing Through the Noise
RF is everywhere. Almost every electronic device in your house and pocket—your cellphone, tablet, laptop, smart assistant, smartwatch, and wireless speakers all contain RF technology. The entire wearable segment is built on RF technology. RF design is often called “black magic,” but designing an RF PCB isn’t that much different than designing a traditional circuit board—if you know what you’re doing—and can cut through the noise.
In the April 2025 issue of Design007 Magazine, our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Siemens Acquires ASTER Technologies to Deliver Industry-leading PCB Test Engineering Solutions
01/14/2026 | PRNewswireSiemens announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software.
Avnet Insights Survey: Engineers Embracing AI and Confronting Its Challenges
01/14/2026 | AvnetArtificial intelligence’s (AI) integration in designed products and solutions is here, and engineers are embracing the technology while identifying the challenges it may present.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
01/14/2026 | I-Connect007The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
ESD Alliance Reports Electronic System Design Industry Posts $5.6 Billion in Revenue in Q3 2025
01/13/2026 | SEMIElectronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Where Electronics Manufacturing Turns for Trusted Technical Insight
01/12/2026 | I-Connect007 Editorial TeamIn an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.