Beyond Design: How Signals Survive the Hostile PCB Environment
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
Peter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
