It’s Only Common Sense: Being Your Customer’s Expert—The Key to Consultative Sales
The Chemical Connection: Surface Finishes for PCBs
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
April 9, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Peter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Share on:
Suggested Items
Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
04/11/2025 | AvnetDesign engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
The Shaughnessy Report: Always With the Negative Waves
04/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I started covering PCB design in the ‘90s, RF designers comprised a small percentage of the design community. Other than cellphones and handheld GPS devices, RF wasn’t seen very often outside of military, aerospace, and law enforcement applications. Now, RF is everywhere. Almost every electronic device in your house and pocket—your cellphone, tablet, laptop, smartwatch, and wireless/smart speaker—contains RF technology. The entire wearable segment is built on RF technology
Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
04/08/2025 | SiemensSiemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.
Designing Through the Noise: April 2025 Design007 Magazine
04/08/2025 | I-Connect007 Editorial TeamIn the April 2025 issue of Design007 Magazine, our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.