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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Crealights, GlobalFoundries Deepen Global Strategic Partnership

09/08/2026 | ACN Newswire
Crealights officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries, a leading global semiconductor manufacturer.

IMAPS Symposium 2026: The Premier Event for Microelectronics Advanced Packaging

09/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at the Encore Boston Harbor in Everett, Massachusetts.

Pasqal Brings Qubit Control On-Chip, Advancing Fault-Tolerant Quantum Computing

08/10/2026 | Globe Newswire
Pasqal, a global leader in neutral-atom quantum computing, announced what it, to its knowledge, believes to be a world-first: the trapping of individual atoms using laser light generated by a photonic integrated circuit (PIC).

Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

NVIDIA, Broadcom Ramp CPO Switch Production

07/27/2026 | TrendForce
TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners.
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