-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
April 15, 2025 | SEMIEstimated reading time: 2 minutes
The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation. Hosted by SEMI, this premier technical conference will feature more than 25 hours of programming, including technical and poster sessions, keynote talks, a panel discussion, a tutorial, and networking opportunities. Registration is now open.
ASMC 2025 will feature over 120 speakers addressing critical topics such as yield enhancement and methodologies, advanced metrologies, advanced process control, and advanced equipment processes and materials. The conference is co-chaired by Katie Lutker-Lee, Process Engineer at TEL Technology Center America and Samira Bagheri, Operations Manager at EMD Electronics.
ASMC 2025 Keynotes and Tutorial
Powering AI: Rising to the Challenge
- Pavel Freundlich, Vice President & Chief Technology Officer of the Power Solutions Group, onsemi
Strategic Directions for Electronics Packaging
- Subramanian S. Iyer, Distinguished Professor, UCLA
Market Update
- Robert Maire, President, Semiconductor Advisors
Materials Intelligence: Enabling the Future of Technology
- Lu Gan, Senior Director, Head of Technology Strategy & Roadmap, EMD Electronics
ASMC 2025 Panel Discussion “High Volume Manufacturing in the Age of AI”
Moderator:
- Marie Tripp, Vice President, UNISERS
Panelists:
- Deepa Desai, Director, Offering and Development Leader, IBM Semiconductor
- Jason Komorowski, Senior Automation and Analytics Engineer, Intel
- Pawitter Mangat, Vice President & Master Innovator, GlobalFoundries
- Ross Kunz, Data Scientist, Idaho National Laboratory
- Safa Kutup Kurt, Global Head of Plant Operations & Digital Transformation, EMD Electronics
ASMC 2025 technical and poster sessions will cover topics including:
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Process Control
- Big Data Management and Machine Learning
- Contamination Free Manufacturing
- Defect Inspection and Reduction
- Equipment Optimization
- Factory Automation
- Industrial and Factory Automation Design and Manufacturing Sustainability
- Novel Devices and Advanced Patterning
- Smart Manufacturing
- Workforce Development
- Yield Enhancement/Methodologies
Two programs will take place in conjunction with ASMC 2025
- SEMI University (SEMI U) Workshop – May 5
- Held for the first time in the Northeast, SEMI U will offer two in-person, instructor-led trainings: “Understanding Semiconductor Technology & Business” and “Advanced IC Packaging & Assembly.”
- ASMC attendees receive a $100 discount on SEMI U registration.
- Women in Semiconductors (WiS) – May 8
- Open to all industry professionals, the WiS program will focus on actionable strategies to support career development and open internal growth opportunities.
- ASMC registrants receive complimentary registration.
Suggested Items
MVTec HALCON Version Includes Deep Learning-Based Technology for Robust Bin Picking
04/15/2025 | MVTecMVTec Software GmbH, a leading global manufacturer of machine vision software, is launching the new version of MVTec HALCON on May 27, 2025. Version 25.05 of the standard machine vision software includes numerous improvements as well as a new technology that combines deep learning algorithms with classic methods.
IPC President’s Award: Dr. Thomas Marktscheffel
04/15/2025 | Nolan Johnson, I-Connect007At ASMPT SMT Solutions, Thomas Marktscheffel, director of product management software solutions, is responsible for the SMT line software portfolio. As a member and leader of several IPC committees, he is also a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852, which make it possible to provide plug-and-play connectivity for intelligent SMT Factories. In 2015, he participated in the IPC-1782 A-team and subsequently joined the IPC-2591 CFX standard A-team, which became the new SMT industry communication standard following its first release in March 2019.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
Northrop Grumman Achieves First-Ever Undocking Between Two Commercial Spacecraft in Geosynchronous Orbit
04/14/2025 | Northrop GrummanA Mission Extension Vehicle (MEV) developed by Northrop Grumman Corporation’s Space Logistics LLC has successfully undocked with Intelsat’s IS-901 satellite, completing its life extension service.