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INEMI Announces Board of Directors Election Results
April 16, 2025 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.
New to the INEMI Board is Tadashi Kosuga, Executive Director and Distinguished Engineer, Commercial Subsystem Development, Lenovo. Returning incumbents include Ravi M. Bhatkal, Managing Director and General Manager for MacDermid Alpha Electronics Solutions; Ranjan Chatterjee, Vice President, Smart Manufacturing Solutions, PDF/SOLUTIONS; Andy Mackie, Principal Engineer and Manager, Thermal Interface Materials Applications for Indium Corporation; and Chris Rumer, Vice President, Foundry Technology Development and Director, Chandler Assembly Technology Development, Intel Corporation.
“In addition to overseeing business operations and general affairs, our Board members play a very important role in guiding INEMI, helping us focus on issues of importance to the industry, and making sure we maximize value to our member companies,” says INEMI CEO Shekhar Chandrashekhar. “We have a strong group of directors who represent the breadth of the electronics manufacturing supply chain, and they provide the knowledge and expertise to help make INEMI a success. Congratulations to our recently elected Directors. We look forward to working with you.”
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Brent Fischthal - Koh YoungSuggested Items
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
08/26/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates
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06/13/2025 | iNEMIJoin INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
06/09/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.