Elementary, Mr. Watson: PCB Routing: The Art—and Science—of Connection
The Shaughnessy Report: Planning Your Best Route
Target Condition: From Dream House to Drill Files
IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada
April 25, 2025 | IPCEstimated reading time: 1 minute
IPC, the global electronics association, announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth.
In this role, Schneider is responsible for ensuring that the needs of this vital region’s electronics industry are clearly understood and served by IPC and accomplished by developing strong relationships with regional membership, customers, and partners along with providing exceptional service delivery and identifying new business opportunities throughout the electronics eco-system.
With an impressive resume, Schneider brings more than two decades of executive experience with very successful roles and increasing responsibility in the EMS industry (Flex, Sparton) and the medical devices industry (Abbott, Siemens Healthcare). Immediately prior to joining IPC, he served as the vice president of commercial operations, health solutions for Flex in Buffalo Grove, Ill. While there, he led multi-site operations responsible for medical device, equipment and drug delivery for the healthcare industry.
“As our members, partners and other industry stakeholders meet Joe and see him in action, it will become very apparent that developing strong relationships with our targeted community and finding creative ways to address their challenges are part of his natural DNA. We look forward to him implementing the right strategies to better know the industry and in parallel fulfill our mission to serve the membership,” said Sanjay Huprikar, IPC’s chief global officer.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth
06/12/2025 | Priority SoftwarePriority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.