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Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
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Discover the Future of AI in Test and Inspection in the May 2025 Issue of SMT007 Magazine
May 1, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements in AI shaping the electronics manufacturing industry through test and inspection? The May 2025 issue of SMT007 Magazine provides insights, innovations, and perspectives from today's top experts you won't find anywhere else.
This month, we explore intelligent test and inspection and its transformative impact on manufacturing processes. From AI-powered inspection technologies to factory analytics, discover how AI is revolutionizing efficiency, quality, and sustainability across the industry.
Highlights include:
- Breaking Down Barriers: Explore machine connectivity in SMT production lines with Dr. Bill Cardoso.
- AI Revolutionizing Inspection: Learn how AI-driven optical inspection is enhancing defect detection and predictive analytics.
- Training AI Together: Discover how federated learning enables industry-wide AI models while protecting proprietary data.
- IPC-CFX 2.0: Uncover the latest updates to the global standard for digital manufacturing communication.
We also kick off a new feature called "In-depth with...," an exclusive ongoing series that takes you behind the scenes of groundbreaking products and services. In this inaugural edition, we spotlight compelling conversations with innovators from GEN3 and Critical Manufacturing.
- Flip through the May 2025 issue of SMT007 Magazine
- Add the PDF of this magazine to your library
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Nolan’s Notes: Our Spotlight on North America
05/05/2026 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we wrap up our electronics world tour with a final stop in the United States and Canada, where we look at the challenges, opportunities, and geopolitical dynamics affecting the market today. What makes American electronics unique? Key U.S. administration policy decisions, like tariffs, are significantly affecting electronics manufacturing. Others, such as the current conflict with Iran and the associated closures of the Strait of Hormuz, affect the raw materials that feed our supply chain.
May SMT007 Magazine: Putting North America in Focus
05/04/2026 | I-Connect007 Editorial TeamA North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing. Read this issue of SMT007 Magazine now and see where the region is headed.
Mexico’s Wire Harness Pivot Point
04/22/2026 | Nolan Johnson, SMT007 MagazineMexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Nolan’s Notes: Wire Harness—The Underdog of the Industry
04/01/2026 | Nolan Johnson -- Column: Nolan's NotesMy dad’s favorite cartoon character was “Underdog,” one of the very first American Saturday morning cartoon shows. When someone asked him for help, Underdog would proudly declare, “Never Fear! Underdog is here!” Over time, I learned that “underdog” had a wider, more socially poignant meaning than just the name of a cartoon superhero. These stories about underdogs kept coming to mind while working on this issue about the challenges facing the wire harness industry. The product is not exactly glamorous and is often treated as an afterthought, but it is most certainly critical to the system.