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Discover the Future of AI in Test and Inspection in the May 2025 Issue of SMT007 Magazine
May 1, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements in AI shaping the electronics manufacturing industry through test and inspection? The May 2025 issue of SMT007 Magazine provides insights, innovations, and perspectives from today's top experts you won't find anywhere else.
This month, we explore intelligent test and inspection and its transformative impact on manufacturing processes. From AI-powered inspection technologies to factory analytics, discover how AI is revolutionizing efficiency, quality, and sustainability across the industry.
Highlights include:
- Breaking Down Barriers: Explore machine connectivity in SMT production lines with Dr. Bill Cardoso.
- AI Revolutionizing Inspection: Learn how AI-driven optical inspection is enhancing defect detection and predictive analytics.
- Training AI Together: Discover how federated learning enables industry-wide AI models while protecting proprietary data.
- IPC-CFX 2.0: Uncover the latest updates to the global standard for digital manufacturing communication.
We also kick off a new feature called "In-depth with...," an exclusive ongoing series that takes you behind the scenes of groundbreaking products and services. In this inaugural edition, we spotlight compelling conversations with innovators from GEN3 and Critical Manufacturing.
- Flip through the May 2025 issue of SMT007 Magazine
- Add the PDF of this magazine to your library
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Fall 2025 Issue of Community Magazine Now Available
10/20/2025 | I-Connect007Now available! The Fall 2025 issue of Community Magazine delivers another stellar issue packed with member profiles, workforce development and sustainability wins, policy updates, factory data standards, personality features, news from around the world, and much more..
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
10/20/2025 | Marcy LaRont -- Column: Marcy's MusingsJust before we were ready to publish our October issue of PCB007 Magazine, some breaking news from the White House, unfortunately (but perfectly) parlayed into why the topic of this month’s issue has been so important to cover in great depth.
Our Legislative Outlook: PCB007 Magazine October 2025 Issue
10/16/2025 | I-Connect007 Editorial TeamMost agree that we are experiencing an unprecedented time in global business and economics, with rules and laws that open doors to business but can complicate operations and make profitability more challenging. This month, PCB007 Magazine features some of today’s leading experts on legislative issues affecting the electronics industry, including rules and laws, trade, sustainability, business expansion, grants, and more in the U.S., Europe, and China.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
October 2025 SMT007 Magazine: Upgrading Your Production Software
10/01/2025 | I-Connect007 Editorial TeamEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone? The October 2025 issue of SMT007 Magazine investigates business operations software and how best to achieve the necessary integrations.