Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Dixon, Inventec Form JV for PC Manufacturing in India
May 5, 2025 | DixonEstimated reading time: 2 minutes
Dixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec. The said JV Company will undertake manufacturing of Notebook PC Products, Servers, Desktop PC Products including Components in India.
Inventec Corporation, founded in 1975, manufactures Notebooks, Desktops PC, AIO, servers and handheld devices and has developed a strong foundation for global success. Inventec is one of the world’s top 5 PC ODM.
Commenting on this occasion, Mr. Atul B. Lall, Vice Chairman & Managing Director, “We are delighted to partner with Inventec, a global leader in IT hardware manufacturing. This joint venture marks a significant milestone for Dixon as we expand our portfolio into high growth segments of notebooks & servers. With Dixon’s operational efficiency and local expertise and Inventec’s technological prowess in the IT hardware segment, we shall be striving to produce high-quality products while driving technological innovation and contributing to the development of India’s IT infrastructure. The partnership aligns with the Government of India’s vision of promoting domestic manufacturing & self-reliance under the Make in India scheme.”
Mr. Jack Tsai, President of Inventec, “Dixon stands as one of India’s most prominent electronics manufacturing firms, distinguished by its mature production systems, high degree of automation, and strong alignment with local government policies. This joint venture utilizes Dixon’s robust domestic manufacturing capabilities and Inventec’s strengths in the capabilities of engineering, supply chain and systems integration. The partnership significantly enhances our operational agility and service coverage within the Indian market. By offering a more diversified manufacturing footprint, we aim to strengthen supply chain resilience, optimize cost-efficiency, and align with Inventec’s long-term globalization strategy.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.