-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
May 12, 2025 | BEST Inc.Estimated reading time: 1 minute

BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Our component salvaging services include BGA’s, QFN’s and LGA’s, BGA re-balling, and reconditioning. All are performed with strict MSD and ESD safeguards. We also offer remarking, bake-out, and packaging in trays, tubes, or tape and reel in accordance with EIA-481 standards. The process involves mechanical disassembly of electronic devices, selective removal of soldered components, reconditioning of leads and pads, laser marking for traceability, and packaging optimized for automated circuit board assembly.
BEST specializes in properly processing and preparing printed circuit boards, ensuring components are safely removed and correctly conditioned for re-insertion into the manufacturing flow. Harvesting components from PCBs helps alleviate shortages of high-value or hard-to-source electronic devices. Our expertise includes reconditioning ball grid arrays, ultra-fine pitch QFPs, QFNs, LGAs, and other electronic packages, providing end-users with confidence in our high-quality reclaiming processes. Our extensive experience in BGA removal, replacement, and reballing makes our salvaging services particularly effective and valuable. With years of industry expertise, we deliver the highest yields while maintaining strict standards of quality and reliability.
In conjunction with our ongoing electronic component reclamation activities, BEST is actively involved with the development of the IPC-7712 Component Reclaim Standard to advance circularity within the electronics manufacturing industry and expand the ability of component reuse as opposed to recycling of electronic waste.
The importance of using high-quality workmanship standards throughout the component reclamation process is essential. This serves to ensure the integrity of the component supply chain, facilitating environmental responsible practices, and reducing reliance on energy intensive fabrication of new electronic components.
Suggested Items
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
07/18/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
Hyliion Awarded U.S. Navy Contract to Advance Multi-Unit KARNO Power Module
07/18/2025 | BUSINESS WIREHyliion Holdings Corp., a leading provider of innovative KARNOTM Power Modules, announced it has been awarded a Phase II Small Business Innovation Research (SBIR) contract in the amount of $1.5 million from the U.S. Navy to further develop and refine its scalable multi-megawatt platform for shipboard and stationary military applications.
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.