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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Driving to the Future: A Pivotal Role in Standards for IPC China Automotive Electronics Committee
May 20, 2025 | Sydney Xiao, IPCEstimated reading time: 1 minute
In 2024, China’s automotive industry reached new heights. According to the China Association of Automobile Manufacturers (CAAM), the annual production of passenger vehicles surpassed 31 million units, marking a 4% year-over-year growth. Meanwhile, the production of new energy vehicles exceeded 12 million units, a remarkable 36.4% increase.
Behind these impressive numbers lies a collective effort fueled by technological innovation, industrial upgrades, and the dedication of countless industry professionals.
These statistics are more than mere figures; they reflect a vibrant and dynamic industry. Factory floors buzz with activity as engineers race against time to develop the next generation of chips. In the meeting rooms, heated discussions lead to decisions that optimize supply chains and drive market breakthroughs. Within this wave of progress, IPC China Automotive Electronics Committee (CAEC) plays a pivotal role, contributing to the industry's journey toward high-quality development.
2025 IPC CAEC Annual Kickoff Meeting
On the afternoon of Jan. 7, 2025, the warm atmosphere of IPC's Shanghai office set the stage for the 2025 IPC CAEC Annual Kickoff Meeting. Chair Zhenghua Cao took to the stage with enthusiasm, reflecting on the achievements of the past year while laying out a bold vision for the future.
The Birth of IPC CAEC: A Professional Platform for Automotive Electronics
IPC CAEC was officially established in 2022 amid the rapid development of China’s automotive electronics industry. Comprising representatives from OEMs and supply chain enterprises within the automotive electronics sector, the committee aims to create a professional platform tailored to the industry's unique characteristics and trends. Its mission is to provide expert guidance in areas such as IPC standard development, talent cultivation, government collaboration, and industry research—all to drive high-quality growth in automotive electronics.
Continue reading this article in the Spring 2025 issue of IPC Community.
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Volkswagen Group, Qualcomm Sign Letter of Intent to Power Next Generation Driving Experiences
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Infineon, Lenovo Partner to Power Next-Generation Software-Defined Vehicles
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DENSO Signs Joint Development Agreement with MediaTek for Automotive SoC
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FIH Achieves ISO 26262 and ISO/SAE 21434 Dual Certifications from DEKRA
12/29/2025 | FoxconnFIH, a subsidiary of Hon Hai Technology Group (Foxconn) announced that its key automotive electronics product, the Telematics Control Unit (TCU), has successfully passed DEKRA process certification and obtained both ISO 26262 Functional Safety certification and ISO/SAE 21434 Automotive Cybersecurity certification.
imec, Japan’s ASRA Align to Standardize Automotive Chiplet Architectures
12/23/2025 | Imecimec – a world-leading research and innovation hub in nanoelectronics and digital technologies – announced a strategic alignment initiative with Japan’s Advanced SoC Research for Automotive (ASRA), aimed at harmonizing the standardization of chiplet architectures for automotive applications.