-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
STARTEAM GLOBAL Signs Contract with SAP
July 2, 2025 | STARTEAM GLOBALEstimated reading time: Less than a minute
We’re excited to announce that STARTEAM GLOBAL has signed a contract with SAP, the global leader in enterprise applications and business AI, to transform our ERP system, with the project starting on September 1, 2025.
Our CEO Daniel Jacob and Chief Digitalisation Officer Rico Knapper officially signed the contract alongside Andreas Schäfer and Vivian Gerwens from SAP, marking the start of this important partnership.
With SAP, key benefits include:
- Process automation and efficiency gains
- Improved data transparency and decision-making
- Compliance and scalability
- Supports future business models and growth
This partnership will strengthen our operational performance, drive innovation, and help us better serve customers worldwide. We look forward to leveraging it to enhance our capabilities and customer experience.
Suggested Items
PMGC Holdings Signs Letter of Intent to Acquire Profitable U.S.-Based Electronics Manufacturing Company
06/10/2025 | Globe NewswirePMGC Holdings Inc., a diversified public holding company, is pleased to announce the signing of a non-binding Letter of Intent (LOI) to acquire a U.S.-based, cash-flow positive electronics contract manufacturing company with over 40 years of operational history.
Electroninks' MOD and iSAP Game Changers
03/25/2025 | Marcy LaRont, PCB007 MagazineElectroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication.
The Future of Electronics Manufacturing in APAC
01/30/2025 | Daniel Schmidt, MKS' ATOTECHThe Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.