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I-Connect007 is excited to announce the debut of Optimize the InterconnectSM—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
In the premiere two-part episode, “What is OTI?,” Ryder breaks down the foundational ideas behind the Optimize the Interconnect (OTI) approach. This unified strategy brings together laser processing, surface treatment, and plating chemistry to improve via reliability, performance, and production efficiency.
This series complements the just-released companion guide, which offers engineering teams a technical deep dive into unified via formation and real-world case studies demonstrating the benefits of OTI.
- Listen to the first episode here.
- Read the companion guide here.
Stay tuned! This is the start of an essential conversation around more innovative, faster, and more integrated interconnect solutions.
