-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging
July 21, 2025 | SK keyfoundryEstimated reading time: 2 minutes
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor packaging technologies and strengthening the competitiveness of automotive semiconductor products.
RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. It is primarily used in WLP (Wafer Level Packaging) and FOWLP (Fan-Out Wafer Level Packaging) processes to enhance connectivity between the chip and the substrate while minimizing signal interference. The newly co-developed Direct RDL by SK keyfoundry and LB Semicon supports power semiconductors with high current capacity, outperforming competitors. The technology achieves a metal wiring thickness of up to 15 μm and wiring density covering up to 70% of the chip area – making it suitable not only for mobile and industrial applications but also for automotive use. In particular, the solution meets the Auto Grade 1 classification under AEC-Q100 international automotive semiconductor quality standard, ensuring reliable operation in harsh environments with an operating temperature range of –40℃ to +125℃. Unlike competitors, this makes the technology fully viable for automotive products. In addition, by providing a Design Guide and Process Development Kit, SK keyfoundry can now offer a process solution tailored to customer needs, enabling smaller chip sizes, lower power consumption, and cost-effective packaging.
Semiconductor packaging and testing specialist LB Semicon stated that leveraging SK keyfoundry’s deep understanding of semiconductor processes and advanced manufacturing capabilities significantly shortened the development timeline. Through the integration of its own back-end processing technologies with SK keyfoundry’s foundry process expertise, the two companies successfully achieved optimized wafer-level Direct RDL formation, which is expected to greatly enhance production efficiency.
LB Semicon’s CEO Namseog Kim commented, “The joint development of direct RDL has served as an important milestone in strengthening the technological competitiveness of SK keyfoundry and LB Semicon.” He also added, “Through close collaboration between the two companies, we plan to establish a strong foothold in the next-generation semiconductor packaging market, built on high reliability.”
“The joint development with LB Semicon, the semiconductor packaging specialist, holds significant meaning as it demonstrates the successful integration of our company’s advanced and comprehensive manufacturing expertise into cutting-edge semiconductor packaging process development,” said Derek D. Lee, CEO of SK keyfoundry. “SK keyfoundry will continuously collaborate with LB Semicon, a leading company in semiconductor technology, to further evolve and position ourselves as a premier foundry with proven capabilities in delivering high-performance and high-reliability semiconductor solutions to the global market.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.
SEMICON Taiwan 2025 Hits Record Global Participation Amid AI-Driven Industry Shift
09/03/2025 | SEMISEMICON Taiwan 2025 enters its final countdown, spotlighting the global AI chip boom and the industry’s rapid transformation.
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%
09/01/2025 | TrendForceTrendForce’s latest investigations reveal that global foundry revenue in 2Q25 reached a record US$41.7 billion, up 14.6% QoQ, thanks to China’s consumer subsidy program spurring early stocking, along with upcoming demand for new smartphones, notebooks/PCs, and servers launching in the second half of the year.