The Optimize the InterconnectSM podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the InterconnectSM is gaining traction across the industry.
This engaging series explores how MKS’ ESI is redefining microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
In this new episode, “OTI: Why It Matters,” Ryder explores why industry leaders are adopting this unified approach to increase efficiency and reliability in design and manufacturing.
The podcast series is complemented by a newly released companion guide, which provides engineering teams with a technical deep dive into the unified via formation methodology, including case studies that highlight the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!