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New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
July 28, 2025 | I-Connect007Estimated reading time: Less than a minute
The Optimize the InterconnectSM podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the InterconnectSM is gaining traction across the industry.
This engaging series explores how MKS’ ESI is redefining microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
In this new episode, “OTI: Why It Matters,” Ryder explores why industry leaders are adopting this unified approach to increase efficiency and reliability in design and manufacturing.
The podcast series is complemented by a newly released companion guide, which provides engineering teams with a technical deep dive into the unified via formation methodology, including case studies that highlight the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/29/2025 | I-Connect007The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover
09/29/2025 | I-Connect007Episode 3 of On the Line With... American Standard Circuits, “How Does Ultra HDI Benefit: Routing Capabilities,” features host Nolan Johnson in conversation with returning guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI technology is transforming design for manufacturability and expanding what’s possible in routing capabilities.
On the Line With… Podcast: UHDI and RF Performance
09/22/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra High Density Interconnect (UHDI).