-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
July 31, 2025 | PRNewswireEstimated reading time: 1 minute

Teramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
AI is driving exponential infrastructure growth, pushing the limits of data movement speed and efficiency. To meet these escalating performance and power demands, the industry must adopt advanced optical interconnects to pass data between compute and networking components. Teramount makes this possible with their TeraVerse™ solution: a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.
The confidence in Teramount demonstrated by this round is a result of two factors:
- Teramount is rapidly emerging as the de facto industry standard for optical fiber to silicon interconnect solutions, partnering with leading companies in the ecosystem, including foundries, silicon and photonics companies, and outsourced assembly and test (OSAT) vendors.
- The explosive growth in demand for higher performance in AI infrastructure makes optical connectivity an undisputed necessity.
“This investment, which brings together strong financial and strategic investors, representing important parts of the optical connectivity ecosystem, is a testament to the potential of our technology in AI infrastructure and other high-performance applications,” said Hesham Taha, CEO and co-founder of Teramount. “We are grateful to our new and existing investors for their support.”
“Optical interconnects are critical components of the future of AI infrastructure, and Teramount is poised to be a leading supplier of these solutions,” said Isaac Sigron, managing director at KDT Israel, who will join Teramount’s board of directors. “We are very impressed with the position Teramount has established in the market and its partnerships with key industry players.”
The funding will enable Teramount to grow its team and scale to volume production, ahead of the market adoption of CPO (co-packaged optics).
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB Group