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Brian O’Donnelly Appointed to Expanded Role, Strengthening Global Leadership to Drive Growth in the Fujifilm’s Electronic Materials Business
July 31, 2025 | FujifilmEstimated reading time: 1 minute
FUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business. He will continue serving as the President and CEO of FUJIFILM Electronic Materials USA, Inc., Senior Deputy General Manager of the Electronic Materials Business Division, FUJIFILM Corporation and Global Vice President of FUJIFILM Electronic Materials.
Born and educated in Scotland, O’Donnelly has spent the majority of his 40-year career working in the Chemical and Semiconductor Materials industries, joining Fujifilm group in 2004. In 2014, he was appointed President and CEO of FUJIFILM Electronic Materials USA, where he has led significant growth of the business and its contributions to Fujifilm through new product development, customer and product portfolio expansions, and mergers and acquisitions.
“Brian is a strong leader who has long contributed to the development of the Fujifilm’s Electronic Materials business, not just in North America, but also globally through strategic acquisitions and integrations that have allowed us to expand our portfolio of products and services to meet the needs of the world’s top semiconductor manufacturers,” said Tetsuya Iwasaki, Director, Senior Vice President and General Manager of the Electronic Materials Business Division, who leads the global business.
Prior to joining Fujifilm, O’Donnelly worked for Olin Corporation’s Materials Metal Research Labs in R&D, as well as Arch Chemicals, where he held progressively more senior roles in finance, strategic planning, M&A and business management within its Chemicals and Electronic Materials Divisions.
“I am looking forward to continuing to help our global business realize its full growth potential and be the leading and most trusted Electronic Materials partner in the global semiconductor industry,” said O’Donnelly. “As Corporate Vice President at FUJIFILM Corporation, I am honored to contribute to the company’s commitment to global diversity and to be part of an inclusive leadership culture that reflects our expanding global business portfolio.”
O’Donnelly holds a PhD in Metallurgy from the University of Strathclyde in Glasgow, Scotland. He earned his MBA in Finance & Strategy Planning from the University of New Haven in Connecticut.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/01/2026 | Michelle Te, I-Connect007If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.
Electronics Manufacturing Needs Your Voice: Global Sentiment Survey Now Live
04/30/2026 | Global Electronics AssociationThe latest monthly Global Sentiment Survey from the Global Electronics Association is now open. At a time when demand uncertainty, policy shifts, energy costs, and supply chain recalibration are pulling the industry in multiple directions, the survey captures something macroeconomic data often misses: how manufacturers are actually experiencing conditions on the ground.
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
Jiva Soluboard Getting the Attention It Deserves
04/30/2026 | Marcy LaRont, I-Connect007 MagazineJiva is a newer company that bridges the divide between PCB fabrication and product circularity or sustainability. Jiva Soluboard is the first fully recyclable laminate material ever created for PCB fabrication, and it's not going unnoticed. Stephen Driver, CEO of Jiva, gave us an update at APEX EXPO, including an exciting certification achievement in February.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.