MACOM Completes Transfer of RTP Wafer Fab
August 5, 2025 | MACOMEstimated reading time: Less than a minute
MACOM Technology Solutions Holdings, Inc., a leading supplier of semiconductor products, announced it has assumed full operational control of the wafer fabrication facility it purchased, located in Research Triangle Park, North Carolina.
This semiconductor wafer manufacturing facility produces highly specialized GaN-on-SiC process technologies for use in RF power devices and monolithic microwave integrated circuits (MMICs). Products manufactured at this site are typically used in telecommunication system infrastructure and defense electronics. The facility is an accredited United States Department of Defense Trusted Foundry.
“This transfer is occurring approximately six months ahead of schedule,” said Stephen G. Daly, MACOM’s President and Chief Executive Officer. “Our leadership and management team are focused on opportunities to improve the fab’s performance and key operational metrics. The best results are yet to come.”
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
SEMI Europe Outlines Six Key Recommendations to Strengthen Chips Act 2.0
04/28/2026 | SEMISEMI Europe announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing and future-proofing Europe’s semiconductor policy framework.
MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026
04/27/2026 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423.
Indium Corporation Joins India’s IDSPS Industry Consortium Partnership
04/24/2026 | Indium CorporationIndium Corporation announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, workforce development, and global supply-chain growth.
SEMICON Southeast Asia 2026 to Convene Leaders in Malaysia for Semiconductor Growth
04/22/2026 | SEMISEMICON Southeast Asia (SEMICON SEA) 2026, the region’s premier platform for the global semiconductor and electronics manufacturing supply chain, will return to the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur from 5 to 7 May. Registration is open.