Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
August 8, 2025 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.
TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.
TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.
Visit TRI's Booth No. K3070 at SEMICON Taiwan 2025 to explore TRI's SEMI solutions.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ViTrox Americas to Showcase Advanced SMT Inspection and Smart Factory Solutions at SMTA Michigan and Ohio Expos
08/07/2025 | ViTroxViTrox Americas Inc. is pleased to announce its participation in the SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, Ohio.
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.
Technica to Host Demo Days Event August 13-14
08/04/2025 | Technica USATechnica USA is proud to announce its upcoming Demo Days Event, taking place August 13–14 at the company’s Demo Center in San Jose, California. The event will feature live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
TRI Unveils New Platform for Diverse Board Sizes
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.