GlobalFoundries Completes Acquisition of MIPS
August 19, 2025 | GlobalFoundriesEstimated reading time: 1 minute
GlobalFoundries (GF) announced that it has completed its acquisition of MIPS, a leading supplier of AI and processor IP. The acquisition strengthens GF’s position as a global leader in differentiated semiconductor manufacturing and enhances its capabilities in AI, edge computing and other high-growth markets.
The combination of GF and MIPS brings together decades of expertise in advanced semiconductor manufacturing and processor IP innovation, enabling GF to deliver more differentiated solutions to meet the growing demand for energy-efficient, high-performance computing at the edge and beyond.
MIPS is expected to continue to operate as a standalone business within GF, maintaining its licensing model and focusing on serving a broad customer base across diverse technology sectors.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend
05/08/2026 | GlobalFoundriesAt its 2026 Investor Day, GlobalFoundries highlighted clear opportunities for durable growth in AI-centric markets, expanding profitability and long-term value creation, underpinned by its broadening technology roadmap for the scaling of AI data centers and the proliferation of AI into the physical world, served from its unique, resilient global manufacturing footprint.
SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem
05/06/2026 | SEMIGlobal experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.
Sharp Increase in Global Semiconductor Sales in Q1 2026
05/05/2026 | ESIAThe European Semiconductor Industry Association (ESIA) reports that, in the first quarter of 2026, the global semiconductor market recorded a sharp increase of 79.2% year-on-year, reaching USD 298.55 billion in sales.
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswireXanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.