Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Green Circuits Expands Cleaning Capability with New Typhoon T-8 Inline Cleaner from Austin American Technology

03/02/2026 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, has installed a new Typhoon T-8 Chemistry Zero-Discharge Inline Cleaner from Austin American Technology (AAT), adding advanced chemistry-based cleaning capability to support increasingly stringent cleanliness requirements across its production programs.

Magnalytix’s Dr. Mike Bixenman to Present at APEX 2026 Technical Conference

02/25/2026 | MAGNALYTIX
Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will co-present the professional development course “The Reliability of the Electronic Assembly and Components as a Function of Assembly Cleanliness” on Sunday, March 15 in Room 304-C of the Anaheim Convention Center as part of the 2026 APEX EXPO Technical Conference.

KYZEN to Showcase MICRONOX Power Electronics Cleaning Chemistries at IMAPS Device Packaging Conference 2026

02/13/2026 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 2-5 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ.

KYZEN’s Adam Klett to Present on Flux Residue Visualization Alternatives at SMTA Pan Pac 2026

01/19/2026 | KYZEN'
KYZEN announced that Adam Klett, KYZEN’s Director of Science will present the technical paper “Seeing the Invisible: A Non-Destructive Approach to Visualizing Flux Residues” at SMTA’s 2026 Pan Pacific Strategic Electronics Symposium.

Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities

11/26/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Solderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in