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Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
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AQUANOX A4618 and CYBERSOLV C8882 to Lead KYZEN Offerings at SMTA Long Island Expo and Tech Forum
August 27, 2025 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Long Island Expo & Tech Forum on Wednesday, Sept. 10, 2025 at the Marriott Melville Long Island. KYZEN regional manager John Norton will be on-site to provide information about aqueous flux cleaner AQUANOX A4618 and understencil solvent CYBERSOLV C8882 during the event.
KYZEN provides effective cleaning solutions for electronics from start to end of your production process including understencil wipe solvent CYBERSOLV C8882 and aqueous chemistry AQUANOX A4618.
AQUANOX A4618 is an aqueous cleaning chemistry designed to address the challenges of cleaning the latest lead-free flux residues, including no-clean and Pb-free residues, while achieving mirrored solder finishes. A4618 has a low cost of ownership, an adjusted stabilizer, and cleans successfully at low concentrations and temperatures.
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid ready for use in automated understencil wipe processes, hand-wiping and ultrasonic cleaning systems. C8882 dries quickly without leaving residue while cleaning solder paste, uncured SMT adhesive and flux residue from stencils, misprinted PCBs, stencil tools and printing squeegees.
For more than 35 years, KYZEN has formulated and provided chemistries to meet a variety of unique cleaning challenges including cleaning stencils and flux residues from finished boards in a wide range of manufacturing processes.
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Green Circuits Expands Cleaning Capability with New Typhoon T-8 Inline Cleaner from Austin American Technology
03/02/2026 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, has installed a new Typhoon T-8 Chemistry Zero-Discharge Inline Cleaner from Austin American Technology (AAT), adding advanced chemistry-based cleaning capability to support increasingly stringent cleanliness requirements across its production programs.
Magnalytix’s Dr. Mike Bixenman to Present at APEX 2026 Technical Conference
02/25/2026 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will co-present the professional development course “The Reliability of the Electronic Assembly and Components as a Function of Assembly Cleanliness” on Sunday, March 15 in Room 304-C of the Anaheim Convention Center as part of the 2026 APEX EXPO Technical Conference.
KYZEN to Showcase MICRONOX Power Electronics Cleaning Chemistries at IMAPS Device Packaging Conference 2026
02/13/2026 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 2-5 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ.
KYZEN’s Adam Klett to Present on Flux Residue Visualization Alternatives at SMTA Pan Pac 2026
01/19/2026 | KYZEN'KYZEN announced that Adam Klett, KYZEN’s Director of Science will present the technical paper “Seeing the Invisible: A Non-Destructive Approach to Visualizing Flux Residues” at SMTA’s 2026 Pan Pacific Strategic Electronics Symposium.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.