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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Ucamco Releases Ucam Xpert and Integr8tor Nexus v2025.06
September 2, 2025 | UcamcoEstimated reading time: Less than a minute
Ucamco is thrilled to announce its 2025.06 release, featuring powerful new upgrades to its flagship products; enhancements the team has been refining for over a year. This update delivers such a significant leap in performance, especially for CAM software, that it comes with a bold new name: Ucam Xpert.
Since its introduction earlier this year, Integr8tor Nexus has been met with overwhelming enthusiasm from customers. This new version takes it even further, boosting its capabilities and adding advanced features to streamline workflows like never before.
Ucamco is also offering an early preview of AI Xtract, its upcoming AI-driven job entry assistant. AI Xtract automates text recognition and data extraction from unstructured PDFs. While selected demos are available now, the official release is planned for the autumn 2025 update.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.
Indium, Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership
05/07/2025 | Indium CorporationIndium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement highlights the power of collaboration in building a more robust global supply chain for gallium.
Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools
06/14/2024 | SiemensSiemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.
CE3S Announces Webinar: Workplace Health & Safety with PACE Fume Extraction Systems
02/26/2024 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), a leading provider of quality goods and services, is excited to announce an upcoming webinar titled "Workplace Health & Safety with PACE & CE3S: Fume Extraction and the Benefits to your Workforce." The webinar will take place on Thursday, March 28, from 1-2 p.m. EDT.
Dana on Data: Nuke the Netlist
01/18/2024 | Dana Korf -- Column: Dana on DataLate last year, I started thinking about the IPC-D-356 netlist. Why do we generate it? What is its purpose? Why are there so many issues using it? The central theme of my I-Connect007 columns, as well as presentations at PCB technical meetings, has focused on improving data package quality sent from designers to manufacturers. The goal is to transfer the design information to manufacturing and build the PCBs as-is. No semi-automated DFM, stackup generation, CAM editing, or data quality analysis should be needed.