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Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
September 4, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Indium Corporation will showcase the following among its featured products:
- Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling capabilities (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse® LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 under optimal process conditions.
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- CW-807RS is a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
- CW-818 is a halide-free, no-clean cored wire with spatter control technology that provides fast wetting speeds to minimize cycle times in manual and robotic soldering processes.
To learn more about Indium Corporation’s high-reliability PCBA solder solutions, visit our experts at booth 901 during the SMTA Guadalajara Expo.
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09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
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Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/04/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.