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Advanced Electronics Packaging Digest

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Northrop Grumman to Advance Military’s Protected Satellite Communications

06/18/2026 | Northrop Grumman
Northrop Grumman Corporation will continue its work on advanced, jam-resistant satellite communications with an award to build a free-flying, Enhanced Protected Tactical Satellite Communications – Prototype (PTS-P) for U.S. Space Force Space Systems Command (SSC).

Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

Lockheed Martin Secures $514M U.S. Space Force Contract for GPS IIIF SV23 & 24

06/16/2026 | Lockheed Martin
Lockheed Martin announced that the U.S. Space Force has awarded the company a $514 million contract to build Global Positioning System IIIF Space Vehicles 23 and 24, bringing its total GPS IIIF commitment to 14 spacecraft.

Teledyne FLIR Defense Unveils Three Vehicle Vision Systems for Enhanced Battlefield Awareness

06/16/2026 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced at Eurosatory the launch of three upgraded vision systems for military vehicles that enhance targeting, improve driver vision, and expand field-of-view up to 360 degrees.

Scanfil Suzhou Expansion Project Breaks Ground

06/16/2026 | Scanfil
Scanfil marked an important milestone in its growth in China with the groundbreaking of its expansion project at the Suzhou plant on June 8.
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