Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Foxconn Announces Q3 2026 Financial Results

11/12/2026 | Foxconn
Hon Hai Technology Group (Foxconn) announced its third quarter 2026 financial results. Revenue, gross profit, operating profit, and net profit for the third quarter and the first nine months of the year all reached record highs for the respective periods.

Diraq Deploys First Silicon Spin Quantum Computer in Commercial Data Center

11/12/2026 | Diraq
Diraq has installed the world's first silicon spin quantum computer inside a commercial data center, now live at Equinix in Sydney, Australia.

Scale-out: From Individual Servers To Interconnected Compute Systems

11/12/2026 | Chetan Arvind Patil, Marvell Technology
The semiconductor industry is moving beyond traditional chip-level scaling toward interconnected computing architectures. Growing demand for AI, high-performance computing (HPC), and data-intensive applications requires greater computing capacity, memory bandwidth, and communication efficiency. As we know, advanced packaging plays an important role in supporting the semiconductor technologies that enable these systems. While scale-up increases the capability of tightly coupled computing systems, scale-out enables those resources to work together at a larger infrastructure level.

From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Nordson EFD Launches High-Viscosity Jetting System

11/10/2026 | BUSINESS WIRE
Nordson EFD, a Nordson company, announced the launch of its PICO Pµlse® XP HV jetting system designed for extremely precise (XP) assembly applications utilizing high-viscosity (HV) materials like thick silicones, greases, and UV-cure adhesives.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in