Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary

Estimated reading time: 4 minutes

Advanced packaging is becoming the cornerstone of AI semiconductor scaling, with 2.5D/3D integration, CoWoS, CPO, CoPoS, and SoW-X set to drive major gains in performance, bandwidth, and efficiency through the 2020s. This report examines the key technologies, mechanisms, adoption timelines, and competitive dynamics shaping the next era of AI hardware.

Key Points:

• Advanced packaging is redefining AI hardware, with 2.5D/3D, CPO (Co-Packaged Optics), CoPoS (Chip-on-Package-on-Substrate), and SoW-X (System-on-Wafer, eXtreme) set to drive major performance and efficiency gains by the late 2020s.
• With Moore’s Law slowing and advanced node costs climbing, 2.5D/3D packaging has become a primary driver of performance-per-watt and system-level efficiency, with TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) platform setting the industry benchmark.
• CoWoS remains the gold standard for high-density AI/HPC accelerators that are tightly coupled with HBM. CoWoS-L extends integration limits through hybrid RDL/silicon bridges, and CoWoS-R offers cost-focused trade-offs. Virtually all flagship AI accelerators from NVIDIA, AMD, and others are built on either TSMC’s CoWoS-S or CoWoS-L packaging.
• CPO is poised for meaningful adoption in AI networking by the end of the 2020s. CoPoS will enter pilot production in 2026, with a volume ramp likely around 2029. SoW-X could enable wafer-scale AI fabrics with step-change gains in performance per watt around the decade’s end.

Overview:

Advanced packaging is becoming the cornerstone of AI semiconductor scaling as Moore’s Law slows and the cost of advanced nodes continues to rise. No longer a back-end cost center, 2.5D/3D packaging has evolved into a primary driver of performance-per-watt, bandwidth density, and system-level efficiency. From EDA tools such as Synopsys 3DIC Compiler and Cadence Integrity 3D-IC to foundry leaders such as TSMC, Samsung, and Intel, and OSATs such as ASE and Amkor, the entire value chain is converging to deliver increasingly complex and capable packaging solutions for AI workloads. The report focuses on foundries’ advanced packaging technologies, adoptions, and competitive landscape with a technical details breakdown.

Figure 1: Key Advanced Packaging Technologies to Watch

Too Important to Ignore Unpacking Advanced Packaging for AI Semiconductor – Report Summary

Strategic Importance of Advanced Packaging

The demand for AI accelerators with extreme bandwidth and low latency is pushing traditional interconnect technologies to their physical and economic limits. Advanced packaging technologies—such as TSMC’s CoWoS variants, future CPO, CoPoS, and SoW—address these constraints by enabling denser integration of compute and memory, reducing interconnect lengths, and improving thermal and power characteristics. For hyperscalers, chip vendors, and investors, these packaging innovations are critical to sustaining AI performance scaling through the decade.

TSMC’s CoWoS Leadership

Since its 2012 debut, TSMC’s CoWoS has become the gold standard for high-density AI and HPC integration, particularly when paired with HBM. CoWoS-S (silicon interposer) remains the workhorse for the most demanding designs. In contrast, CoWoS-L (hybrid RDL and silicon bridges) supports even larger packages—used in NVIDIA’s latest Blackwell GPUs—and CoWoS-R (organic RDL interposer) offers cost trade-offs with reduced density. Nearly all flagship AI accelerators from NVIDIA, AMD, and Broadcom rely on TSMC packaging, underscoring its market dominance.

Next-Generation Platforms

• CPO: Integrates optical engines directly adjacent to switch ASICs or compute dies, eliminating long electrical traces and reducing power, latency, and signal loss. Early implementations deliver 1.6–3.2 Tbps per optical link, with late-2020s adoption expected in AI accelerators.
• CoPoS: A hybrid approach reducing silicon interposer area by combining fine-pitch silicon only where needed with organic redistribution layers elsewhere. Ideal for networking ASICs and AI accelerators. Pilot production is expected in 2026, with mass ramp around 2029.
• System-on-Wafer (SoW): Retains multiple dies on a reconstructed wafer with wafer-scale RDL and local silicon bridges, collapsing inter-package hops and dramatically improving performance-per-watt. The SoW-X platform, revealed in 2025, supports up to 16 full-reticle ASICs and 80 HBM4 stacks, delivering ~1.76× performance-per-watt over CoWoS-L.

Market Outlook and Considerations

TSMC’s advanced packaging capacity remains a potential bottleneck potentially through 2028, given sustained AI demand. Industry participants should monitor CPO ecosystem readiness, CoPoS production milestones, and SoW-X manufacturability, as well as competing offerings from Intel and Samsung. These technologies not only promise performance breakthroughs but also have the potential to reshape supply chain dynamics and capital expenditure priorities across the semiconductor industry.

Conclusion

Advanced packaging is no longer optional—it is a strategic necessity for AI scalability. CoWoS will remain dominant in the near term, but CPO, CoPoS, and SoW-X represent the next wave of performance and efficiency enablers for the late 2020s. Companies that secure supply, co-develop with ecosystem partners, and align product roadmaps with these packaging innovations will be best positioned to capitalize on the next era of AI-driven growth.

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