-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
September 18, 2025 | Globe NewswireEstimated reading time: 2 minutes
The global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions. Latest industry estimates suggest that the market will reach US$ 13.6 billion by 2025, expanding at a robust CAGR of 9.3% from 2025 to 2032, ultimately achieving a valuation of approximately US$ 25.3 billion by 2032. Key growth drivers include rising investments in high-performance printed circuit boards (PCBs) and the exponential growth of lithium-ion battery (LiB) production for electric vehicles (EVs) and energy storage systems.
Market Insights
With innovations in electronic miniaturization and automotive electrification gaining momentum, there is a heightened demand for ultra-thin and high-performance copper foils. Regulatory emphasis on sustainable energy, particularly in Europe and Asia Pacific, further boosts market expansion, with manufacturers scaling production to meet the demand from EV and energy storage sectors.
Key Drivers
- Expanding EV Battery Production: Global electric mobility trends significantly contribute to the growth of the electrodeposited copper foils industry. As lithium-ion batteries are central to EVs, there is an increasing demand for ultra-thin copper foils as current collectors. Governments' ambitious EV targets prompt manufacturers to innovate thinner, high-performance foils.
- Rising Demand for PCBs in Consumer Electronics: The proliferation of 5G networks and IoT devices heightens the need for advanced PCBs. Electrodeposited copper foils, offering excellent adhesion and uniformity, are critical for manufacturing multilayer PCBs used in smartphones, tablets, laptops, and wearables.
- Technological Advancements in Copper Foil Manufacturing: Continuous R&D enhances foil thickness, surface treatment, and conductivity, presenting new opportunities in flexible PCBs, next-gen batteries, and miniaturized circuits.
Business Opportunities
The market offers lucrative prospects for stakeholders across various sectors. Companies that align with ultra-thin foils for EVs and high-performance foils for PCBs are poised to capture substantial value. The integration of copper foils in renewable energy storage further broadens demand. Partnerships between copper foil manufacturers, EV battery makers, and electronics firms foster innovation, ensuring robust supply chains. Additionally, circular economy initiatives, including copper recycling, present opportunities aligned with sustainability objectives.
Regional Analysis
- Asia Pacific leads the market, anchored by strong EV battery manufacturing in China, South Korea, and Japan. This region benefits from major PCB producers and governmental support for green mobility.
- North America experiences rapid growth, driven by gigafactory expansions in the U.S. and Canada, with a strong EV manufacturer presence.
- Europe's investments in EV battery gigafactories and advanced electronics manufacturing continue to play a crucial role, aligned with stringent environmental policies.
- Latin America and the Middle East & Africa emerge with increasing renewable energy adoption and expanding industrial electronics markets.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.