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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
September 22, 2025 | Global Electronics AssociationEstimated reading time: 2 minutes
The Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more. The Association's upcoming conferences and tradeshows connect leaders, engineers, and technologists with the solutions and insights they need most.
“From design to assembly to recycling, no single company or industry sector can achieve progress in isolation,” said John W. Mitchell, Global Electronics Association president and CEO. “Our Association provides the forums where critical conversations happen, connections are made, and the future of the industry is shaped.”
The Association’s upcoming events include:
- IPC CEMAC – September 25-26, Shanghai – This year’s conference, themed “Shaping a Sustainable Future,” will address critical advancements in AI-enabled digital transformation, next-generation packaging technologies, PCB/PCBA process innovations, and ESG-driven sustainability practices. The program is designed to strengthen cross-border collaboration and accelerate technology development that underpins the long-term resilience and sustainable growth of the global electronics industry.
- Pan-European Electronics Design Conference (PEDC) – January 21-22, 2026, Prague, Czech Republic – Co-organized with Fachverband Elektronikdesign und -fertigung e. V. (FED), the technical conference addresses the industry’s pressing design challenges. Featuring peer-reviewed presentations, attendees gain access to cutting-edge research on silicon-to-systems integration, proven Design for Excellence (DfX) methodologies, and sustainable design frameworks that meet new EU regulations. The conference is limited to 400 participants to ensure meaningful networking and direct access to presenting experts.
- Integrated Electronics Manufacturing & Interconnections (IEMI) – January 29-30, 2026, Bengaluru, India – India’s premier electronics event features the World Wire Harness Competition, vendor development workshops, one-to-one business matchmaking, educational sessions, and a product showcase.
- APEX EXPO – March 14-19, 2026 – Anaheim, Calif. – North America’s largest electronics industry gathering expects more than 400 exhibitors and 7,000 attendees. OEMs, EMS providers, PCB manufacturers and industry professionals from around the globe come together to access the latest technical content, contribute to standards development, and take part in exclusive product and service launches and the Design Village, where next-generation advanced electronic packaging and system co-design come to life. Pre-conference professional development workshops on March 15-16 offer technical training and the Learning Lounge with workforce training and certification tracks takes place, March 17-19.
- EWPTE (Electrical Wire Processing Technology Expo) – May 5-7, Milwaukee, Wisc. – The leading event for wire harness, cable, and connector technologies, delivering hands-on technical training and access to top-tier suppliers and innovations.
Added Mitchell, “In an industry where technological advances and supply chain resilience are crucial to success, these events provide the connections, partnerships, and knowledge that drive measurable business results and help address shared challenges.
Register now at electronics.org/events or contact events@electronics.org for group discounts. Follow @GlobalElectronicsAssociation on LinkedIn for real-time updates and speaker announcements.
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