Beyond Design: The Fundamental Structure of Spectral Integrity
Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Indium Expert to Present on Solder Paste Solutions at SMTA Empire Expo and Tech Forum
September 29, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.
The presentation, Engineering Out Defects: Solder Paste Selection and Handling Best Practices, will focus on solder paste selection, storage, and handling best practices for printed circuit board (PCB) assembly, and will connect the principles to the defect mechanisms they influence. Each best practice is an opportunity to prevent defects and promote a robust assembly process.
“Reliable PCB assembly starts long before the first print,” said Burt. “From the time the paste is manufactured to the moment it’s put on the stencil, disciplined handling protocols preserve and optimize performance.”
Burt is based at Indium Corporation’s global headquarters in Clinton, New York. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation’s materials, as well as providing product and process training. Burt earned his bachelor’s degree in chemistry from Clarkson University, and he is a Certified SMT Process Engineer (CSMTPE).
The presentation will take place on Wednesday, October 1, at 11:00 a.m.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Indium Introduces 2026 DIY Internship Program to Empower the Next Generation of Industry Leaders
10/21/2025 | Indium CorporationIndium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional experience based on their individual career goals and interests.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.