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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EDADOC Ushers in a New Era of Robotics Innovation
October 7, 2025 | Edy Yu, Editor-in-Chief, ECIOEstimated reading time: 2 minutes
On Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.
The Zhijing T-series embodies an intelligence edge computing power platform.
MScape, incubated by Shanghai Jiao Tong University and the Shanghai Artificial Intelligence Research Institute, is a high-tech company born to create a domestic software and hardware ecosystem for computing power. As generative AI sweeps the globe, artificial intelligence is advancing toward artificial general intelligence (AGI). Embodied intelligence—things that are perceptive and capable of action, such as robots, autonomous vehicles, and drones—is the next strategic high ground in global tech competition.
Previously, the domestic Chinese embodied intelligence industry faced three dilemmas: reliance on imported edge-side computing power, security risks, and high costs. MScape’s domestic edge computing power platform not only provides dense computing power up to 1500 TOPS but also constructs a fully autonomous and controllable system spanning everything from hardware chips to the operating system. This innovation addresses the industry pain point of asynchronous coordination between the brain (decision-making) and the small brain (execution) in traditional platforms. This breakthrough supports a more robust network intelligence security protection system and provides strong cybersecurity power in the construction of Digital China and Chinese-style modernization.
Notably, MScape’s Zhijing T-series embodied intelligence edge computing power platform features PCB design, manufacturing, and component placement for its 30+-layer ultra-high-level HDI PCB boards, completed by EDADOC. Producing the boards took two weeks from order to shipment. Showcasing the company’s commitment to customers and drive toward excellence (despite Typhoon Taba making landfall near Zhuhai), working overtime, EDADOC's Zhuhai PCBA factory completed production late at night before the typhoon's arrival, and delivered the product within 48 hours.
When the typhoon closed schools in Zhuhai and Shenzhen, and ground flights in Zhuhai, the company’s marketing department members took the first early morning flight available from Shenzhen airport, delivering the product to the customer that same morning. This efficient production and outstanding product quality earned high praise from its partners, with one stating, "They completed an impossible task."
EDADOC’s Zhuhai PCB Factory is at the forefront of the industry in high-impedance precision, high aspect ratio technology, high multi-layer alignment technology, back-drilling STUB technology, large-size technology, and advanced HDI technology. Recently, it completed orders for six-layer HDI, 58-layer ATE, and 32-layer boards with a length of 1.32 meters and a thickness of 6.8 mm, and orders requiring 5% impedance accuracy, 1–4 mil back-drilling precision, and a finished hole aspect ratio of 75:1.
EDADOC aims to speed the development of global hardware products and contribute to the advancement of the domestic intelligent robotics industry.
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