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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Insulectro: Advanced PCB Fabrication Materials

04/23/2026 | Real Time with... APEX EXPO
Explore advanced PCB fabrication materials with Insulectro's Dain Hertsgaard and Gabriel Zepeda. This interview covers Arlon's innovative polyimide and epoxy solutions, including low-flow options for flex materials and high-performance materials for HDI applications; Qnity's polyimide films for demanding environments, and DuPont Interra's capacitance films for enhanced reliability. Insulectro offers comprehensive service and a commitment to advancing circuit technology

Advanced Electronics Packaging at APEX EXPO with Matt Kelly

04/20/2026 | Real Time with... APEX EXPO
The first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.

Siborg LCR-Reader Professional Multimeter

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Indium Faces Complex Soldering Head On

04/17/2026 | Real Time with... APEX EXPO
Kevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.

The Future of Reflow Soldering Is Here

04/16/2026 | Real Time with... APEX EXPO
Michael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
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