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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Real Time with... SMTAI 2025: Advancing PCB Manufacturing with Laser Depaneling from LPKF
November 12, 2025 | Real Time with...SMTAIEstimated reading time: Less than a minute
Marcy LaRont and Jake Benz of LPKF discuss the growing interest in laser depaneling technology. Jake introduces the CuttingMaster 2246, a high-power laser that enhances the processing of FR4 substrates.
Click here to watch the interview now.
For more coverage from the event, visit the Real Time with... SMTA International 2025 site.
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Sweeney Ng - CEE PCBSuggested Items
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.
CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics
03/11/2026 | NcodiNCEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.